Sponsored by Honeywell.
With the continuing trend of reduction of electronic device dimensions, there is a growing demand for effective cooling solutions as the electronics required to be more powerful and compact, and the increased data transfer speed and processing of 5G devices will generate elevated levels of heat. In this application note, we’ll examine the applications driving TIM requirements, different types of TIMs, their composition, and key considerations when selecting such material.
Honeywell has met the advanced materials and application requirements of electronic device manufacturers for more than 50 years, and provides vital materials for thermal management across multiple industries.
